Title:
RESISTANCE TEMPERATURE FUSE PACKAGE AND RESISTANCE TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP2011175893
Kind Code:
A
Abstract:
To provide a resistance temperature fuse package capable of improving operation characteristics, and to provide a resistance temperature fuse.
The resistance temperature fuse includes: a base body which has a plurality of substrates laminated and has a recessed portion on the substrate positioned on the uppermost layer; a temperature fuse element which is installed crossing over the recessed portion; and a heating resistor which is installed on the base body and is formed in a region overlapping with the temperature fuse element in a plan see-through.
Inventors:
Miyawaki, Kiyoshige
Application Number:
JP2010000039799
Publication Date:
September 08, 2011
Filing Date:
February 25, 2010
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01H37/76