Title:
RESISTANCE THERMAL FUSE PACKAGE AND RESISTANCE THERMAL FUSE
Document Type and Number:
Japanese Patent JP2011124092
Kind Code:
A
Abstract:
To provide a resistance thermal fuse package and a resistance thermal fuse improving an operational characteristic.
The resistance thermal fuse includes a base body including a plurality of laminated substrates and having a pair of recesses in the topmost substrate, a thermal fuse element provided on the substrate in a region between the pair of recesses in a plane view, and a heating resistor provided in the substrate in a region overlapping the thermal fuse element in the plane view.
Inventors:
Miyawaki, Kiyoshige
Ogasawara, Atsushi
Kawabata, Kazuhiro
Ogasawara, Atsushi
Kawabata, Kazuhiro
Application Number:
JP2009000280780
Publication Date:
June 23, 2011
Filing Date:
December 10, 2009
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01H37/76
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