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Patent Searching and Data


Title:
抵抗器
Document Type and Number:
Japanese Patent JP5320612
Kind Code:
B2
Abstract:
The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.

Inventors:
Koichi Hirasawa
Hitoshi Amamiya
Atsushi Hayashi
Application Number:
JP2009521655A
Publication Date:
October 23, 2013
Filing Date:
June 26, 2008
Export Citation:
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Assignee:
KOA Corporation
International Classes:
H01C1/084; H01C1/034; H01C1/14; H01C17/02
Domestic Patent References:
JP2001244666A2001-09-07
JPH0582002U1993-11-05
JPH08181001A1996-07-12
JPH045601U1992-01-20
JPH04123502U1992-11-09
JP2002290090A2002-10-04
JPH03238852A1991-10-24
JP2006245478A2006-09-14
JP2001110830A2001-04-20
JPH0855935A1996-02-27
JP2001244666A2001-09-07
JPH0582002U1993-11-05
JPH08181001A1996-07-12
JPH045601U1992-01-20
JPH04123502U1992-11-09
JP2002290090A2002-10-04
JPH03238852A1991-10-24
JP2006245478A2006-09-14
JP2001110830A2001-04-20
JPH0855935A1996-02-27
Attorney, Agent or Firm:
Shintaro Hotta