Title:
リテーナリング
Document Type and Number:
Japanese Patent JP4814916
Kind Code:
B2
Abstract:
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
Inventors:
Hozumi Yasuda
Tetsuji Togawa
Osamu Nabeya
Kenichiro Saito
Makoto Fukushima
Satoshi Inoue
Tetsuji Togawa
Osamu Nabeya
Kenichiro Saito
Makoto Fukushima
Satoshi Inoue
Application Number:
JP2008187568A
Publication Date:
November 16, 2011
Filing Date:
July 18, 2008
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/005; B24B37/04; B24B37/30; B24B37/32; B24B49/10; H01L21/304
Domestic Patent References:
| JP3123851U | ||||
| JP11188618A | ||||
| JP10113863A | ||||
| JP2000354949A | ||||
| JP2000127024A | ||||
| JP945642A |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa