PURPOSE: To make it possible to hold a multitude of wafers without making high a device by a method wherein a plurality of side pillars are disposed in upright at positions, where the central angle of a main pillar is divided equally, centering around the main pillar disposed in upright in the center of a pedestal and wafer insertion grooves are engraved in the side pillars and the main pillar at a necessary pitch in the perpendicular directions to the pillars.

CONSTITUTION: A main pillar 11 is disposed in upright in the center of a pedestal 10 and three side pillars 12 are disposed in upright at equal intervals centering around the main pillar 11. The main pillar 11 and the respective two side pillars 12 have a diameter of a circle to roughly circumscribe about the wafers 4 and grooves, in which the wafers 4 are inserted, are engraved in the pillars 11 and 12 at a necessary pitch in the perpendicular directions to the pillars. The wafers 4 are supported by the one main pillar 11 and the two side pillars 12 at three points on both sides of said main pillar 11 and are held in three columns centering around the main pillar 11. Thereby, as the wafers can be held in a plurality of columns, several times of the wafers can be held in the same height as that of a conventional device.