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Title:
RETENTION STRUCTURE OF THERMAL PROTECTOR AND ELECTRONIC APPARATUS USING THIS
Document Type and Number:
Japanese Patent JP2006244761
Kind Code:
A
Abstract:

To provide a retention structure of a thermal protector and a heating element capable of improving adhesiveness between the thermal protector and the heating element such as a battery without bringing forth lowering of resin moldability and a contact area of fixing resin and the battery or the like, even if the size of the thermal protector is made as large as ever.

With the retention structure enabling the fixing resin to stably retain the thermal protector with the battery in adhesion or in adjacency, adhesiveness of the thermal protector to the heating element of a battery or the like can be improved without bringing forth deterioration of a contact area of the fixing resin with the battery or the like, and a portable communication equipment, a portable telephone or the like using the retention structure can be provided.


Inventors:
Yamamoto, Kiyoshi
Takeuchi, Seiichiro
Nagai, Takeshi
Application Number:
JP2005000055913
Publication Date:
September 14, 2006
Filing Date:
March 01, 2005
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD:THE
FURUKAWA SEIMITSU KINZOKU KOGYO KK
International Classes:
H01H37/04; H01H37/54; H01H37/00



 
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