Title:
REVERSAL PATTERN FORMATION METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019045864
Kind Code:
A
Abstract:
To provide a reversal pattern formation method excellent in embedding property of a composition for forming a pattern reversal film between resist patterns, and excellent in removal selectivity of the resist patterns, and a manufacturing method of an electronic device.SOLUTION: There is provided a reversal pattern formation method having a process for forming a resist film on a substrate using a photosensitive composition having a prescribed A value of 0.14 or more, a process for exposing a light to the resist film, a process for developing the exposed resist film and forming a resist pattern, a process for forming a pattern reversal film by applying the composition for forming the pattern reversal film so that the resist pattern is coated, a process for exposing a surface of the resist pattern by etch backing the pattern reversal film, and a process for removing the resist pattern to form the reversal pattern. Formula (1):A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×0.04+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127).SELECTED DRAWING: None
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Inventors:
SAKIDA KYOHEI
Application Number:
JP2018164735A
Publication Date:
March 22, 2019
Filing Date:
September 03, 2018
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F220/12; G03F7/004; G03F7/039; G03F7/20; G03F7/40; H01L21/027
Attorney, Agent or Firm:
Nozomi Watanabe
Hideaki Ito
Fumio Mitsuhashi
Hideaki Ito
Fumio Mitsuhashi