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Title:
REVERSE PATTERN FORMATION METHOD, COMPOSITION FOR REVERSING IMAGES AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018124297
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a reverse pattern formation method capable of forming narrow reverse patterns without generation of problems of pattern collapse, and capable of forming narrow reverse patterns excellent in processability of a processed film when using as a mask.SOLUTION: There is provided a reverse pattern formation method including (a) a process for forming an active ray-sensitive or radiation-sensitive film by using an active ray-sensitive or radiation-sensitive resin composition, (b) a process for exposing light to the active ray-sensitive or radiation-sensitive film, (c) a process for forming a negative type pattern containing a residual film part and a space part by developing the exposed active ray-sensitive or radiation-sensitive film with a developer containing an organic solvent, (d) a process for applying a composition for reversing images on the negative type pattern and embedding the composition for reversing images into the space part, and (e) a process for removing the residual film part of the negative type pattern by an etching treatment to obtain a reverse pattern, in which the composition for reversing images contains a resin and percentage content of a silicon atom and a metal atom in the resin is total 0 to 20 mass%.SELECTED DRAWING: None

Inventors:
KATO KEITA
TANGO NAOHIRO
GOTO AKIYOSHI
Application Number:
JP2015109554A
Publication Date:
August 09, 2018
Filing Date:
May 29, 2015
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/40; C08F12/24; G03F7/004; G03F7/038; G03F7/039; G03F7/20; H01L21/027
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi