Title:
RIGID SUBSTRATE, MANUFACTURING METHOD OF THE SAME, SUPPORT SUBSTRATE FOR SEMICONDUCTOR, AND AUXILIARY PLATE FOR POLISHING PAD
Document Type and Number:
Japanese Patent JP2022044987
Kind Code:
A
Abstract:
To provide a rigid substrate that has high rigidity comparable to that of a glass epoxy substrate, suppresses warpage, and is less likely to produce cutting debris during cutting process.SOLUTION: The rigid substrate has at least an adhesive layer A1, a resin film layer B1 disposed on one main surface of the adhesive layer A1, and a resin film layer B2 disposed on the other main surface of the adhesive layer. The total thickness is greater than a predetermined value. The adhesive layer A1 is formed of a cured material of a predetermined adhesive composition. The thickness of the adhesive layer A1 and the storage modulus (E'25) of the adhesive layer A1 at 25°C measured at a frequency of 1.0 Hz are greater or equal to predetermined values. The thicknesses of the resin film layer B1 and the resin film layer B2 are each greater than or equal to a predetermined value.SELECTED DRAWING: Figure 1
Inventors:
AKIYAMA SEIJI
TANII SHOTA
MORINO AKINORI
TANII SHOTA
MORINO AKINORI
Application Number:
JP2020150421A
Publication Date:
March 18, 2022
Filing Date:
September 08, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
H01L23/14; B32B27/16; C09J7/29; C09J7/30; C09J201/00; H05K1/03
Attorney, Agent or Firm:
Ogawa Shinji
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno
Previous Patent: JPWO2022044986
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