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Title:
リング成形装置、及びリング成形方法
Document Type and Number:
Japanese Patent JP7079491
Kind Code:
B2
Abstract:
To provide a ring molding device 1 by which even if a set of two annular elements Wo are integrally diameter-expanded in the state that end faces S on a cross section thick side are brought into contact with each other, press molding can be performed without provision of a press molding part 9 according to respective directions thereof, and to provide a ring molding method.SOLUTION: A ring molding device 1 for molding a set of two annular elements Wo comprises: a rolling molding part 4 which integrally expands diameters of the set of two annular elements Wo in the state that end faces S on a cross section thick side are brought into contact with each other, and obtains a first molded wheel body Wm1 and a second molded wheel body Wm2; a second transport path 8 for transporting the first molded wheel body Wm1 in a transport direction X; and a rotating mechanism part 7 which rotates the second molded wheel body Wm2 around a virtual straight line, which is substantially orthogonal to the transport direction X, as a rotation axis in a radial direction of the second molded wheel body Wm2, and delivers the same to the second transport path 8.SELECTED DRAWING: Figure 9

Inventors:
Kadoya Yoshiki
Application Number:
JP2018177523A
Publication Date:
June 02, 2022
Filing Date:
September 21, 2018
Export Citation:
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Assignee:
Kyoei Seiko Co., Ltd.
International Classes:
B21H1/06; B21H1/16; F16C33/64
Domestic Patent References:
JP2006320927A
JP4311121B1
JP57138822U
JP4415630Y1
JP201880050A
JP5318013A
Foreign References:
GB225195A
Attorney, Agent or Firm:
Motoaki Nagata
Yoshiaki Nagata