PURPOSE: To transfer without inflicting damage upon the surface and end face of a material by removing a receiving plate provided with a line up/insertion pallet and a recess from a separation plate provided with a recess at the same time and turning over.
CONSTITUTION: When a line up/insertion pallet 8 and a resin thermoset after being printed on the surface of a brittle thin plate material 7 overlap, a receiving plate 9 provided with a recess is set onto a separation plate 10 provided with a convex in the condition where it is overlapped on the line up/insertion pallet 8 and contacted. Next, when external force is applied through the projection of the separation plate 10 provided with the projection from the setting condition, the receiving plate 10 provided with the convex shifts to the recess to separate. After turning over in this condition, the line up/insertion pallet 8 is removed and a transfer pallet 12 to be transferred is recontacted. Then the receiving plate 9 provided with the recess is removed and transferred on to the transfer pallet 12 and lined up.
WO/2015/161349 | A DEVICE FOR LIFTING AND TRANSPORTING SHEET MATERIAL |
JPH0834234 | [Title of Invention] Wafer Transfer Device |
JPS6216913 | CONVEYING DEVICE |