Title:
エッチング装置用リング状部品及びこれを用いた基板のエッチング方法
Document Type and Number:
Japanese Patent JP7307769
Kind Code:
B2
Abstract:
A ring-shaped element (10) for an etcher includes a body portion (100) having an outer diameter surface (102) connecting an outer contour of an upper surface (106) and an outer contour of a bottom surface, and an inner diameter surface (104) connected to an inner contour of the upper surface, and a mounting portion (200) having an upper surface (206) connected to the inner diameter surface of the body portion at a position lower than the upper surface of the body portion, and an inner diameter surface (204) connecting an inner contour of the upper surface and an inner contour of a bottom surface. The upper surface of the mounting portion is stepped from the upper surface of the body portion to constitute a substrate mounting portion. The surface or entire body of the ring-shaped element includes necked boron carbide-containing particles, and the thermal conductivity of the ring-shaped element at 400 °C is 27 W/m·K or less.
More Like This:
| JP2532353 | VAPOR ETCHING METHOD AND DEVICE |
| JPH06318581 | DRY ETCHING METHOD |
| JP2018014170 | PLASMA PROCESSING APPARATUS |
Inventors:
Yellow planting
Lee Jae Bomb
Wu Binroku
Minoru Yor
Kinkyo Jin
Ginger Nakane
Lee Jae Bomb
Wu Binroku
Minoru Yor
Kinkyo Jin
Ginger Nakane
Application Number:
JP2021118226A
Publication Date:
July 12, 2023
Filing Date:
July 16, 2021
Export Citation:
Assignee:
SK enpulse Co.,Ltd.
International Classes:
H01L21/3065; C04B35/563
Domestic Patent References:
| JP2007230787A | ||||
| JP2017135159A | ||||
| JP5339079A | ||||
| JP54095612A | ||||
| JP2002533911A | ||||
| JP2008524108A | ||||
| JP3168600U |
Foreign References:
| WO2018061778A1 |
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito
Previous Patent: Scanning electron microscope and objective lens
Next Patent: Analysis device and image processing method
Next Patent: Analysis device and image processing method