Title:
RIVET-CALKING DEVICE
Document Type and Number:
Japanese Patent JP3718371
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a damage to a circuit on a substrate when an electric connector is fixed on the substrate with a rivet-calking.
SOLUTION: A rivet-calking device 1 has a connector holder unit 250 on which a connector and a substrate 50 are placed. An anvil (a supporting mold) 150 is located at the lower side, and an upper tool unit 92 is located at the upper side of the connector 200, respectively. When the upper tool unit 92 is descended to calk a rivet 220, a link mechanism is driven interlocked with the descent, and the anvil 150 is slightly lifted up by the projecting part 148 of a cam as a cam plate 80 moves leftward, the rivet 220 inserted into the connector 200 is calked between a crimper 134 of the upper tool unit 92 and the anvil 150. A slight spacing is caused by a spring terminal between the substrate 50 and the connector 200 before calked however they are calked together without a spacing between them and resulting in no deformation of the substrate 50.
Inventors:
Hiroshi Yagawa
Application Number:
JP14331399A
Publication Date:
November 24, 2005
Filing Date:
May 24, 1999
Export Citation:
Assignee:
Tyco Electronics Amplifier Co., Ltd.
International Classes:
B21J15/10; B21J15/14; H05K13/04; H01R9/20; (IPC1-7): B21J15/14
Domestic Patent References:
| JP52120270A |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma