Title:
ロールアセンブリ
Document Type and Number:
Japanese Patent JP3610369
Kind Code:
B2
Abstract:
Method of bonding or linkage between a first place (1) or a given material and another place (2) of another material, characterized in that thermodeformable bimetal elements (4) are interposed between the first piece (1) and the second piece (2). The first piece (1) and the second piece (2) may have different coefficients of expansion. The thermodeformable elements (4) are designed so that the bonding forces between the two pieces are independent of a variation in the operating temperature of the assembly.
Inventors:
Jean Claude Companion Chopin
Application Number:
JP13539993A
Publication Date:
January 12, 2005
Filing Date:
May 13, 1993
Export Citation:
Assignee:
VESUVIUS FRANCE SOCIETE ANONYME
International Classes:
B65G39/02; B65G39/07; C03B35/18; F16B4/00; F16C13/00; F27B9/24; F27D3/02; F27D5/00; (IPC1-7): F16B4/00
Domestic Patent References:
| JP1317911A | ||||
| JP1098702A | ||||
| JP2180302A |
Attorney, Agent or Firm:
Kunihiko Ohashi
Yu Koyama
Yu Koyama