Title:
ROLLED COPPER FOIL FOR PRINTED CIRCUIT BOARD, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2012057231
Kind Code:
A
Abstract:
To provide a rolled copper foil for a printed circuit board with improved solder dip resistance of a CCL (copper-clad laminate) in which a roller copper foil is stuck on a surface of a base material for a printed circuit board, and a manufacturing method therefor.
The rolled copper foil 1 for a printed circuit board is formed by sequentially laminating a roughened copper plating layer 4, a nickel-cobalt alloy plating layer 5, zinc plating layer 6, a chromate treatment layer 7 and a silane coupling layer 8 on the sticking surface of the base material side in a copper foil 2. The total plating amount of nickel and cobalt in the nickel-cobalt alloy plating layer 5 is ≥20 μg/cm2 and ≤45 μg/cm2.
Inventors:
GOTO CHIZURU
TAGA KATSUTOSHI
ITO YASUYUKI
NUKAGA TSUNEJI
TAGA KATSUTOSHI
ITO YASUYUKI
NUKAGA TSUNEJI
Application Number:
JP2010203401A
Publication Date:
March 22, 2012
Filing Date:
September 10, 2010
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C25D3/56; C25D7/06; H05K1/09
Domestic Patent References:
| JP2007119902A | 2007-05-17 | |||
| JP2010141227A | 2010-06-24 | |||
| JP2009164488A | 2009-07-23 |
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Now Satoshi
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Now Satoshi
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