To provide a roller plating method which can uniformly form a plated film on the surface of a metal substrate, and to provide a roller plating apparatus.
The roller plating method includes: rotating a pair of plating rolls 10, which sandwiches both faces of a metal substrate 18; also supplying a plating solution 12 to the plating rolls 10; and electrolytically plating both of the surfaces of the metal substrate 18 while moving the metal substrate 18 in a vertical direction. The plating solution 12 is supplied to the plating rolls 10 by immersing at least one part of the plating rolls 10 into the plating solution 12 accommodated in a plating tank 14, or immersing at least one part of rolls adjacent to the plating rolls 10 into the plating solution 12 accommodated in the plating tank 14 and rotating the adjacent rolls.
YOSHIDA SHIN
HASEGAWA HAJIME
MIZUNO KATSUHIRO
DEWAKI KENJI
AISIN TAKAOKA LTD
NIPPON CHEMICAL DENSHI KK
Jun Ishida
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