To provide an industrially produceable, fast-setting and room temperature curable adhesive composition.

The room temperature curable adhesice composition comprises 100 pts.wt. polymer (i.e., modified silicone-based resin) having a silicon-containing organic group having three alkoxy groups directly bonded to a silicon atom, and substantially composed of a polyoxyalkylene as the main chain, 0.5-20 pts.wt. ketimine silane such as N-(1,3-dimethylbutylydene)-3-(triethoxysilyl)-1- propaneamine, and 0.5-5 pts.wt. silanol condensation catalyst.