Room temperature joining device

Japanese Patent JP6125443

B2

The normal temperature bonding device is equipped with a bonding chamber, an upper side stage mechanism whereby an upper side wafer is supported in such a way as to be vertically movable inside the bonding chamber, and a lower side stage mechanism whereby a lower side wafer is supported in such a way as to be movable within a horizontal plane inside the bonding chamber. The lower side stage mechanism comprises a carriage having a lower side wafer holding part for holding the lower side wafer, an elastic guide coupled to the carriage and supporting the carriage, a positioning stage for coarsely moving the lower side wafer holding part, a fine movement mechanism for finely moving the lower side wafer holding part, and a carriage support block. The elastic guide supports the carriage in such a manner that the carriage does not come into contact with the carriage support block when no load is being applied from the upper side stage mechanism onto the carriage, and elastically deforms so that the carriage comes into contact with the carriage support block when the upper side stage mechanism brings the upper side wafer into contact with the lower side wafer, thereby applying a vertical load onto the carriage.

Masato Kinouchi
Takayuki Goto
Takeshi Tsuno
Kensuke Ide
Suzuki Takenori

JP2014006869A

May 10, 2017

January 17, 2014

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Mitsubishi Heavy Industries Machine Tool Co., Ltd.

H01L21/02; B23K20/00; H01L21/68; H01L21/683

JP2009208084A
JP2011119293A
JP5160340A

Minoru Kudo
Keisaku Nakao
Taro Ishikawa

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