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Patent Searching and Data


Title:
ROTATING APPARATUS
Document Type and Number:
Japanese Patent JP2003134735
Kind Code:
A
Abstract:

To provide a rotating apparatus which does not need cutting after a rotational shaft and a rotational element are assembled, reduces sway of the rotational element in the axial direction when the rotational element rotates, and can improve rotation accuracy and stability of the rotational element.

The rotating apparatus 1 is provided with the rotational element 5 formed from the rotational shaft 2, a hole 5a that the rotational shaft 2 is pressed and fitted into, and a chucking face 4 for chucking a disk 3. The rotational element 5 is fitted into the hole 5a and rotates on the rotational shaft 2. A depth of the hole 5a of the rotational element 5 is t. A press fit width for fitting the rotational shaft 2 and the hole 5a of the rotational element 5 is c. A diameter of the chucking face 4 of the rotational element 5 is L. A tolerance of face sway, in outermost circumference of the chucking face 4 of the rotational element 5 in the axial direction is R. The rotational element 5 is pressed and fitted into the rotational shaft 2 and the press fit width c is tR/L or more and 2tR/L or less.


Inventors:
MURAKAMI SOICHI
Application Number:
JP2001324854A
Publication Date:
May 09, 2003
Filing Date:
October 23, 2001
Export Citation:
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Assignee:
SONY CORP
International Classes:
G11B19/20; H02K1/28; H02K7/14; H02K15/16; H02K21/22; (IPC1-7): H02K7/14; G11B19/20; H02K1/28; H02K21/22
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)