To facilitate a through hole formation and the shape processing a to form a conducting circuit for both surfaces of a substrate for power electronics device using a thermosetting resin composition whose thermoplastic resin is filled with a thermal conductive inorganic filler.
Penetrating holes are formed selectively in a glass base material of non-woven fabric cloth in a non-hardening state, and the holes are filled with the thermosetting resin composition whose non-hardening thermoplastic resin contains the thermal conductive inorganic filler. A metal-clad laminate is made by cladding both surfaces with a metal film or a metal plate to harden and to make the area of the filled parts with the inorganic filler smallest which reduces the burden of forming the through hole. Processing of polygonal shape by die punching is realized easily by using a glass fabric epoxy layer as the surroundings of the thermosetting resin composition filled with the thermal conductive inorganic filler.
INABA KEIJI
NAKATANI SEIICHI
HANDA HIROYUKI
MATSUO MITSUHIRO
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