Title:
粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP7166335
Kind Code:
B2
Abstract:
Provided is a roughened copper foil having low-roughness suitable for forming a thin-wire circuit and capable, when used in an SAP method, of providing a layered body with a surface profile which allows for not only excellent etching properties for electroless copper plating and excellent dry film resolution, but excellent circuit adhesion in terms of shear strength. This roughened copper foil has a roughened surface at least on one side thereof. The roughened surface is provided with multiple roughening particles, the average value of the ratio L2/S of the square of the circumferential length L (µm) of a roughening particle to the area S (µm2) of the roughening particle in a 10 µm-long cross-section of the roughened copper foil is 16 to 30, and the roughened surface has a ten-point average roughness of 0.7 µm to 1.7 µm.
Inventors:
Tsubasa Kato
Mitsuyoshi Matsuda
Hiroto Iida
▲高▼梨 哲聡
Kazuhiro Yoshikawa
Mitsuyoshi Matsuda
Hiroto Iida
▲高▼梨 哲聡
Kazuhiro Yoshikawa
Application Number:
JP2020510808A
Publication Date:
November 07, 2022
Filing Date:
March 20, 2019
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D7/06; B32B7/06; B32B15/04; B32B15/20; C25D1/04; C25D5/10; C25D5/16; H05K1/03; H05K3/18
Foreign References:
| WO2016174998A1 | ||||
| WO2017138338A1 | ||||
| WO2014196576A1 | ||||
| WO2016158775A1 | ||||
| WO2018211951A1 |
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Yu Hasegawa
Ryo Kawachi
Hiroki Kashima
Yu Hasegawa
Ryo Kawachi
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