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Title:
Roughening processing copper foil, a copper-clad laminate sheet, and a printed wired board
Document Type and Number:
Japanese Patent JP6087028
Kind Code:
B1
Abstract:
絶縁樹脂との密着性、及び信頼性(例えば吸湿耐熱性)を有意に向上することが可能な粗化処理銅箔が提供される。本発明の粗化処理銅箔は、針状結晶で構成される微細凹凸を備えた粗化処理面を少なくとも一方の側に有し、針状結晶の表面が全体にわたってCu金属とCu2Oの混相からなる。

Inventors:
Mogi Akatsuki
Hiroaki Tsuyoshi
Application Number:
JP2016544486A
Publication Date:
March 01, 2017
Filing Date:
April 06, 2016
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C23C26/00; B32B15/20; C25D1/04; H05K1/05; H05K1/09
Domestic Patent References:
JP2009026491A2009-02-05
JP2006249519A2006-09-21
JP2008248269A2008-10-16
JP2002180157A2002-06-26
JP2002060866A2002-02-28
Foreign References:
WO2010110092A12010-09-30
WO2014126193A12014-08-21
WO2015111756A12015-07-30
WO2015040998A12015-03-26
Other References:
<工程・種類・用途別> めっき最新技術 〜メカニズムの考察と品質向上〜, vol. 第1刷, JPN6016021476, 18 May 2006 (2006-05-18), JP, pages 678 - 680, ISSN: 0003432442
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Taku Takeishi