Title:
Roughening processing copper foil, a copper-clad laminate sheet, and a printed wired board
Document Type and Number:
Japanese Patent JP6193534
Kind Code:
B2
Abstract:
Provided is a roughened copper foil with which both microcircuit formation (particularly circuit linearity) and close adhesion to resin can be achieved in processing of copper-clad laminates and manufacturing of printed wiring boards. This roughened copper foil has a roughened surface on at least one side, and for said roughened surface, Sa × Spd, which is the product of the arithmetic mean height Sa (µm) and the density of peaks Spd (peaks/mm2) that are measured according to ISO 25178, is at least 250000 µm/mm2, and the arithmetic mean waviness Wa measured according to JIS B0601-2001 is 0.030-0.060 µm.
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Inventors:
Shinichi Kobata
Ayumu Tateoka
Yoshikawa Kazuhiro
Ayumu Tateoka
Yoshikawa Kazuhiro
Application Number:
JP2017526725A
Publication Date:
September 06, 2017
Filing Date:
June 16, 2016
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B32B15/08; C25D7/06; C25D1/04; C25D5/10; C25D5/16; H05K1/09
Domestic Patent References:
| JP2013019056A | 2013-01-31 | |||
| JP2004263296A | 2004-09-24 | |||
| JP2014201777A | 2014-10-27 |
Foreign References:
| US20130220679A1 | 2013-08-29 |
Other References:
JPN6017021714; 三宅 淳司: '銅箔の概要' エレクトロニクス実装学会誌 ６／６, 20030612, ５２８-５３３, エレクトロニクス実装学会
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Taku Takeishi
Hiroki Kashima
Taku Takeishi
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