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Title:
ROUND-TRIP ENVELOPE
Document Type and Number:
Japanese Patent JP2009292494
Kind Code:
A
Abstract:

To provide a round-trip envelope which can cope with such problems as mail information such as addresses and names at the time of transmission and reply and stamp pasting columns, and is extremely practical, in relation to the round-trip envelope capable of performing both sending a letter and receiving a reply by one envelope.

The round-trip envelope includes an envelope body composed of a film made of a synthetic resin, and a sheet for displaying addresses and names which is formed into two-folded through a bending part so as to be wound around an inserted article enclosed in the envelope body, and is constituted so that an address and name displaying column for sending a letter and an address and name displaying column for receiving a reply are respectively displayed on one piece and on the other piece under a two-folded condition, wherein transparent windows capable of exhibiting outside the address and name displaying column for sending the letter and the address and name displaying column for receiving the reply of the sheet for displaying the addresses and names are formed on the envelope body.


Inventors:
KAMEYAMA TAKASHI
SHIMOSHITA JUNKO
NAKAMURA DAISUKE
HAYASHI MASAYUKI
Application Number:
JP2008147061A
Publication Date:
December 17, 2009
Filing Date:
June 04, 2008
Export Citation:
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Assignee:
KC KK
SHOEI CORP KK
International Classes:
B65D27/00; B65D27/04; B65D27/06; B65D27/34
Domestic Patent References:
JPH0672446A1994-03-15
JPH10511914A1998-11-17
Attorney, Agent or Firm:
Noboru Fujimoto
Seiichi Yakumaru
Hiroaki Nakatani
Yuichi Koyama