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Title:
RUBBER PATCH FOR ATTACHING ELECTRONIC COMPONENT, AND TIRE WITH RUBBER PATCH
Document Type and Number:
Japanese Patent JP2007024723
Kind Code:
A
Abstract:

To sufficiently secure adhesiveness between an inner liner 7 of a tire and a rubber patch 9 for attaching an electronic component.

The first rubber layer 25 comprises a rubber material containing no vulcanization promoter, has the first attaching face 29 attached directly to the inner liner 7, on its one side and has the first junction face 31 on the other side, and the second rubber layer 27 is layered on the first rubber layer 25. The second rubber layer 27 comprises a rubber material containing a vulcanization promoter, has the second junction face 33 bonded to the the first junction face 31 of the first rubber layer 25, on its one side and has the second attaching face 35 capable of attaching directly or indirectly the electronic component 11, on the other side, and the whole second rubber layer 27 is vulcanized under the condition where the first junction face 31 and the second junction face 33 are bonded each other. The first rubber layer 25 and the second rubber layer 27 are vulcanization-bonded, since the vulcanization promoter contained in the second rubber layer 27 is bled on the second junction face 33 to cause a cross-linking reaction on the first junction face 31.


Inventors:
WATANABE YOICHI
MASAOKA MASARU
HIRONAKA TAKANOBU
Application Number:
JP2005208587A
Publication Date:
February 01, 2007
Filing Date:
July 19, 2005
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
G01L17/00; B60C19/00; B60C23/04
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu



 
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