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Title:
RUBBER-REINFORCED RESIN COMPOSITION AND ITS MOLDING AND LAMINATE
Document Type and Number:
Japanese Patent JP2008156577
Kind Code:
A
Abstract:

To provide a rubber-reinforced resin composition which is heat resistant and also transparent and is suitable as a molding material for a substrate for a transparent laminate laminated with a transparent film.

The rubber-reinforced resin composition contains 10-50 mass% of (A) a rubber-reinforced vinyl-based resin or a mixture of the rubber-reinforced vinyl-based resin and a (co)polymer of vinyl-based monomer (except for component (B) and component (C) below), 30-80 mass% of (B) a maleimide-(meth)acrylate-based copolymer and 10-60 mass% of (C) a (meth)acrylate-aromatic vinyl compound-based copolymer (the total of the component (A), component (B) and component (C) is 100 mass%). The total content of the rubbery polymers of the composition is 5-30 mass%. Its heat deflection temperature under load is 80C. Its total light transmission is 70%.


Inventors:
KAKIUCHI HIROYOSHI
SUGINO SHIGEKI
Application Number:
JP2006350229A
Publication Date:
July 10, 2008
Filing Date:
December 26, 2006
Export Citation:
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Assignee:
TECHNO POLYMER CO LTD
International Classes:
C08L33/04; B32B27/00; B32B27/30; C08L35/00; C08L51/04
Attorney, Agent or Firm:
Masatake Ide