To provide a fusing and rupturing method for a adhesive film stuck on the rear face of a semiconductor wafer by a laser beam without being influenced by debris.

The adhesive film 5 is stuck on the rear face of the semiconductor wafer 10 which is separated into a plurality of semiconductor chips, and the adhesive film side is stuck on the surface of dicing tape 60 mounted on an annular frame 7. This method comprises the steps of mounting the dicing tape on a pinching frame surrounding the semiconductor wafer 10 for pinching the dicing tape between the outer circumferential surface of a small diameter ring 7b and the inner circumferential surface of a large diameter ring 7a, by using the pinching frame 7 consisting of the large diameter ring 7a having a diameter larger than the semiconductor wafer 10 and the small diameter ring 7b; mounting closing-tape for closing the space formed by the pinching frame and the dicing tape; and fusing and rupturing the adhesive film 5 along dividing grooves, by irradiating along the dividing grooves from the rear face side of the dicing tape 60 with a laser beam whose wavelength being not absorbed by the dicing tape but absorbed by the adhesive tape.