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Title:
SHEET MATERIAL OF Cu-Ni-Si-BASED COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2008223136
Kind Code:
A
Abstract:

To provide a sheet material of a Cu-Ni-Si-based copper alloy, which has improved strength, improved bendability after having been notched, and improved stress relaxation resistance all in a high level.

The sheet material of the copper alloy has a composition comprising, by mass%, 0.7 to 4.2% Ni and 0.2 to 1.0% Si; further at least one of 1.2% or less Sn, 2.0% or less Zn, 1.0% or less Mg, 2.0% or less Co and 1.0% or less Fe as needed; or further at least one of Cr, B, P, Zr, Ti, Mn and V in a total amount of 3% or less; and the balance substantially Cu: and has a crystal orientation which satisfies the expression of I{420}/I0{420}1.0, wherein I{420} represents the X-ray diffraction intensity of a crystal face {420} on a sheet plane of the sheet material of the copper alloy; and I0{420} represents the X-ray diffraction intensity of the crystal face {420} of a standard powder of pure copper.


Inventors:
KO IRIN
SUDA HISASHI
NARUEDA HIROTO
SUGAWARA AKIRA
Application Number:
JP2007326559A
Publication Date:
September 25, 2008
Filing Date:
December 18, 2007
Export Citation:
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Assignee:
DOWA METALTECH KK
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B5/02; H01B13/00; H01L23/50; C22F1/00
Attorney, Agent or Firm:
Komatsu Taka
Kenji Wada