To provide a solder alloy of Pb-free Zn system for high temperatures having a melting point at about 300-400°C suitable for the assembling or the like of a semiconductor device capable of improving and progressing workability and stress relieving largely and excellent in wettability and reliability.

The solder alloy of the Pb-free Zn system which uses Zn as a main ingredient and does not include Pb contains Al 1.0 mass% or more and 9.0 mass% or less, and contains Cu by 0.001 mass% or more and 3.000 mass% or less, and of which the rest is composed of Zn and inevitable impurities. The solder alloy in the Pb-free Zn system can contain Ag 4.0 mass% or less and/or P by 0.500 mass% or less in order to further progress the wettability or the like.