Title:
METHOD AND APPARATUS FOR INTEGRALLY MOLDING COMPOSITE SKIN MATERIAL
Document Type and Number:
Japanese Patent JP3148064
Kind Code:
B2
Abstract:
PURPOSE: To mold a plurality of skin materials integrally simultaneously and thus improve the bonding strength by bonding the end of a skin material and base material with resin at the groove of a cavity, bonding different skin material and base material at the groove in the same manner, putting the base material and skin material being at the opposite side into touch with each other to be joined with resin injected.
CONSTITUTION: A core movable type mold 20 attached with partial skin material 42 is moved to the side of a stationarly mold 1, and molten resin J is injected into a cavity from a gate 11 so as to form partial skin material 42 and base material. Next, a main movable mold 30 attached with an overall skin material 41 being different from the skin material is moved, and molten resin J is injected from the gate 11 for forming the overall skin material and base material. At this time, the end part of the overall skin material 41 is pressed into a groove 12 by means of a projection 21 of the core movable type mold 20 in order to place the tip end thereof into contact with the resin J. Then, in the form of the resin J in the groove 12, base material and the skin material being at the opposite side contacted one another, they are bonded with the resin J injected from the gate 11.
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Inventors:
Toshio Masuda
Application Number:
JP35343493A
Publication Date:
March 19, 2001
Filing Date:
December 31, 1993
Export Citation:
Assignee:
TS TECH Co., Ltd.
International Classes:
B29C43/18; B29C43/20; B29C43/34; B29C43/36; B29C45/14; B29C45/16; B29C45/26; B29C33/14; B29L9/00; B29L31/58; (IPC1-7): B29C45/14; B29C43/18; B29C45/26
Domestic Patent References:
| JP5208426A |
Attorney, Agent or Firm:
Atsushi Akiyama