Title:
【発明の名称】試料吸着保持装置
Document Type and Number:
Japanese Patent JP2923804
Kind Code:
B2
Abstract:
A suction adhesion-type holder used, for example, in a bonding machine including an air cooling device provided between a bonding stage and a vacuum pump that creates a vacuum suction in the bonding stage through the cooling device. Air suction holes formed in the bonding stage, that has a heating element, are connected to the air cooling device via a pipe and air heated by the bonding stage is cooled in the air cooling device when the heated air flows in a spiral pipe installed inside the cooling device and then sucked into the vacuum pump. The spiral pipe is cooled by a fan.
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Inventors:
OZAWA KANJI
SONODA YUKITAKA
SONODA YUKITAKA
Application Number:
JP30871790A
Publication Date:
July 26, 1999
Filing Date:
November 16, 1990
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
C30B25/12; C30B31/14; F27D5/00; H01L21/52; H01L21/60; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Yoshinori Tanabe