Title:
サンプル処理装置
Document Type and Number:
Japanese Patent JP2004502164
Kind Code:
A
Abstract:
Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group of process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exciting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas. The carriers may be used to apply selective compression to the sample processing devices.
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Inventors:
William Bedingham
Dufresson, Joel Earl.
Harms, Michael Earl.
Kokaisel, Christopher Earl.
North, Diane
Roball, Barry W.
Wood, Kennis Bee.
Dufresson, Joel Earl.
Harms, Michael Earl.
Kokaisel, Christopher Earl.
North, Diane
Roball, Barry W.
Wood, Kennis Bee.
Application Number:
JP2002506066A
Publication Date:
January 22, 2004
Filing Date:
June 28, 2001
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
G01N1/00; B01J19/00; B01L3/00; B01L7/00; B81B1/00; C12M1/00; G01N1/28; G01N35/00; G01N37/00; B01L9/00; F27B9/16; F27D5/00; (IPC1-7): G01N1/00; G01N1/28
Foreign References:
| WO1999046045A1 | 1999-09-16 | |||
| WO1999044740A1 | 1999-09-10 |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Masaya Nishiyama
Higuchi Souji