Title:
地盤改良体のサンプリング装置とこれを用いたサンプリング方法
Document Type and Number:
Japanese Patent JP5303767
Kind Code:
B2
Inventors:
Toshihiko Fujii
Application Number:
JP2011232454A
Publication Date:
October 02, 2013
Filing Date:
October 24, 2011
Export Citation:
Assignee:
Toshihiko Fujii
International Classes:
E02D3/12; E02D1/04; G01N1/08
Domestic Patent References:
JP201152466A | ||||
JP2008115617A | ||||
JP2004332392A | ||||
JP200269993A |
Attorney, Agent or Firm:
Bunji Kamada
Higashio Masahiro
Takayoshi Tagawa
Higashio Masahiro
Takayoshi Tagawa