Title:
MOLDING DEVICE OF POLYMERIC MATERIAL
Document Type and Number:
Japanese Patent JP3214090
Kind Code:
B2
Abstract:
PURPOSE: To provide a device molding a polymeric material, especially, a thermosetting resin within an extremely short time while the generation of a flaw therein is prevented.
CONSTITUTION: A coil conductor 2 is set to the interior of a mold 1 and the periphery of the coil conductor 2 is filled with a molding resin 3 to be heated, cured and molded. In this constitution, a deformable thin plate 4 having proper rigidity is airtightly attached to the inner surface of the mold and pressure from a pressure port 6 is changed so as to follow the curing development of the resin to control the deformation of the thin plate and the generation of a flaw caused by the volumetric contraction of the resin is prevented.
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Inventors:
Yoshishige Fukushi
Nobuhide Fujioka
Toru Koyama
Hirokazu Takasaki
Ikushi Kano
Nobuhide Fujioka
Toru Koyama
Hirokazu Takasaki
Ikushi Kano
Application Number:
JP24167392A
Publication Date:
October 02, 2001
Filing Date:
September 10, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B29C39/10; B29C39/26; B29C39/44; B29K63/00; B29L31/34; (IPC1-7): B29C39/26; B29C39/10; B29C39/44
Domestic Patent References:
| JP4325211A | ||||
| JP54148055A |
Attorney, Agent or Firm:
Yasuo Sakuta