Title:
SANDWICH PANEL AND WALL STRUCTURE
Document Type and Number:
Japanese Patent JP2022052546
Kind Code:
A
Abstract:
To provide a highly strong sandwich panel and a wall structure.SOLUTION: In the entire portion including an inorganic board layer 15 and one or more heat insulation board layers 13, 14, a first part P1 shifted in longitudinal position of a joint between adjacent layers is provided, and the shifting size G of the joint in the first part P1 is 0.5 D1-3.0 D1 with respect to the thicknesses D1 of the heat insulation board layers 13, 14.SELECTED DRAWING: Figure 1B
Inventors:
SATO TSUYOSHI
Application Number:
JP2020158990A
Publication Date:
April 04, 2022
Filing Date:
September 23, 2020
Export Citation:
Assignee:
ASAHI KASEI CONSTR MAT CO LTD
International Classes:
E04C2/292; E04B1/80; E04B1/94; E04B2/74; E04C2/30; E04F13/12
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro Kami
Mitsutsugu Sugimura
Koichiro Kami