Title:
SANDWICH TYPE RESIN COMPOSITE DAMPING ALUMINIUM PANEL EXCELLENT IN WARM MOLDABILITY
Document Type and Number:
Japanese Patent JPH11221876
Kind Code:
A
Abstract:
To realize good moldibility not generating the flow protrusion of a resin and reducing the generation of wrinkles.
A damping aluminum panel having an intermediate resin layer comprising a thermosetting resin wherein the elastic modulus at 180-300°C being warm molding temp. is at least 0.5 MPa or more and the thickness of the resin layer is 100 μm or less is used. By this constitution, the protrusion of the resin or the generation of flange wrinkles at the time of warm molding can be suppressed and the processing of a deep drawing product using the damping aluminum panel becomes possible.
Inventors:
KADOWAKI NOBUO
ABE YUJI
YOSHIDA MASAKATSU
ABE YUJI
YOSHIDA MASAKATSU
Application Number:
JP2683898A
Publication Date:
August 17, 1999
Filing Date:
February 09, 1998
Export Citation:
Assignee:
NIPPON STEEL CORP
SKY ALUMINIUM
SKY ALUMINIUM
International Classes:
B32B15/08; (IPC1-7): B32B15/08
Attorney, Agent or Firm:
Akio Najima (2 others)
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