Title:
鋸刃切削装置および切削方法
Document Type and Number:
Japanese Patent JP7053048
Kind Code:
B2
Abstract:
To provide a saw blade cutting device and a cutting method which provides a proper cutting amount by the use of a center and both ends on a cutting face of an object to be cut and can cut the object to be cut quickly without stagnating chips between blades of a band saw.SOLUTION: A saw blade cutting device includes a base board provided with a placement base on which an object to be cut is placed, a gripping part for gripping the object to be cut which is placed on the placement base, an upper part frame which can oscillate around an oscillating fulcrum as a center, provided on the base board, a saw blade member which is provided on the upper part frame and cuts the object to be cut, an oscillating mechanism which oscillates the upper part frame via the oscillating fulcrum and a vertical movement mechanism which elevates the saw blade member when the upper part frame oscillates on an oscillation end part via the oscillating fulcrum.SELECTED DRAWING: Figure 1
Inventors:
Mochizuki Jin
Application Number:
JP2019172690A
Publication Date:
April 12, 2022
Filing Date:
September 24, 2019
Export Citation:
Assignee:
Sotec Hamamatsu Co., Ltd.
International Classes:
B23D53/04; B23D55/08
Domestic Patent References:
| JP3152124U | ||||
| JP2002321121A | ||||
| JP2003159701A | ||||
| JP61025718A | ||||
| JP57184622A | ||||
| JP61022966U |
Foreign References:
| US20130333536 | ||||
| EP2789437A1 |
Attorney, Agent or Firm:
Patent business corporation Ota patent office