Title:
SAW WIRE
Document Type and Number:
Japanese Patent JP2005193332
Kind Code:
A
Abstract:
To provide a saw wire capable of improving slice cutting efficiency.
The saw wire has the following features. The hardness HD of the surface layer part from the outer surface to the depth of 10 μm is ≥ 800 Hv in Vickers hardness. The residual stress IS of the surface layer part from the outer surface to the depth of 10 μm is on the compression side. The minimum value of an absolute value of the stress is ≥ 10 kg/mm2. The tensile strength TS satisfies the following formula (1) calculated from a diameter (d). Here, the above formula (1) is expressed as TS≥-2,000d+4,200 (MPa).
Inventors:
KUSUDA MASAHIRO
FUKUMURA MASAHITO
FUKUMURA MASAHITO
Application Number:
JP2004002069A
Publication Date:
July 21, 2005
Filing Date:
January 07, 2004
Export Citation:
Assignee:
TOKYO SEIKO CO LTD
International Classes:
B24B27/06; B21C1/00; B21C9/00; B28D5/04; H01L21/304; (IPC1-7): B24B27/06; B21C1/00; B21C9/00; B28D5/04; H01L21/304
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
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