Title:
焼結用Sb-Te系合金粉末及び同粉末の製造方法並びに焼結体ターゲット
Document Type and Number:
Japanese Patent JP5496078
Kind Code:
B2
Abstract:
An Sb-Ti alloy powder for sintering, characterized by consisting of particles having a mean particle diameter of 0.1 to 200µm and by having an oxygen content of 1000wtppm or below; and a sintered target made of an Sb-Te alloy, characterized by an oxygen content of 1000wtppm or below, a bending strength of 50MPa or above, and a relative density of 99% or above. The sintered target has a uniform and refined structure, and is inhibited from cracking and from arcing in sputtering by virtue of the structure. Further, the surface unevenness caused by sputter erosion is reduced, whereby a high-quality Sb-Te alloy sputtering target can be obtained.
Inventors:
Hideyuki Takahashi
Application Number:
JP2010500647A
Publication Date:
May 21, 2014
Filing Date:
February 16, 2009
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
B22F1/00; B22F9/08; C23C14/34; C22C12/00
Domestic Patent References:
| JP2007046165A | 2007-02-22 | |||
| JPH059509A | 1993-01-19 | |||
| JP2004162109A | 2004-06-10 | |||
| JP2006193826A | 2006-07-27 | |||
| JP2007046165A | 2007-02-22 | |||
| JPH11106905A | 1999-04-20 | |||
| JPS63293102A | 1988-11-30 | |||
| JPH059509A | 1993-01-19 |
Foreign References:
| WO2006077692A1 | 2006-07-27 |
Attorney, Agent or Firm:
Isamu Ogoshi