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Title:
SCATTERING PREDICTION DEVICE AND THREE-DIMENSIONAL MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2022074439
Kind Code:
A
Abstract:
To predict scattering of powder material.SOLUTION: A scattering prediction device 7 predicts occurrence of scattering of powder material A caused by application of an electron beam B to the powder material A. The scattering prediction device 7 comprises: a light source 5a for irradiating the powder material A with illumination light L; an imaging device 5b for obtaining a spectrum of light emitted from the powder material A irradiated with the illumination light L; and an evaluation part 8f for predicting occurrence of scattering of the powder material A by utilizing the spectrum of the light.SELECTED DRAWING: Figure 2

Inventors:
KURATA SHINTARO
NOSE HIROYUKI
YAMADA MASATO
KAKIUCHI RYOJI
Application Number:
JP2020184476A
Publication Date:
May 18, 2022
Filing Date:
November 04, 2020
Export Citation:
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Assignee:
IHI CORP
International Classes:
B29C64/386; B29C64/153; B33Y10/00; B33Y30/00; B33Y50/02
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Hideki Komatsu