To provide a scribing apparatus, and an apparatus and method for cutting a substrate using the same.
Disclosed are a scribing apparatus, and an apparatus and method for cutting a substrate using the same. The scribing apparatus forms scribe a line on either the upper or the lower side of a mother substrate, and forms successively scribe lines on the other side of the mother substrate while the directivity of the upper and lower sides of the mother substrate is maintained. Since such feature can proceed the scribing process without reversing the substrate, the process time can be shortened and the productivity of the entire process can be improved. Thus, a facility related to the reversion of the substrate can be eliminated, so the scribing apparatus can be provided by which the layout of the facility can be simplified and the facility cost can be reduced. Also provided are the apparatus and method for cutting the substrate using the scribing apparatus.
| JP2002293560A | 2002-10-09 | |||
| JPH1164834A | 1999-03-05 |
| WO2002057192A1 | 2002-07-25 |
Yoshishige Takeo
Takeshi Sakaguchi
Kyohei Tokioka