To provide a scrub cleaning device suitable to cleaning of a large-area extremely thin wafer.

The scrub cleaning device includes a support member 8 which supports the extremely thin wafer 7 rotatably in a horizontal state by holding an outer peripheral edge of the extremely thin wafer 7, a driving unit which rotates the support member at a predetermined rotational frequency, a roll brush 9 arranged on a wafer top surface and having a rotary shaft parallel with the wafer top surface, and a supply unit which supplies a cleaning liquid 10 to the wafer top surface, and is provided with a nozzle 11 as a wafer plane maintaining means of jetting a liquid such as a stream of water toward the wafer reverse surface to maintain the plane state of the wafer top surface. This device can perform excellent scrub cleaning stably since the plane state of the wafer top surface is maintained through the operation of the wafer plane maintaining means even during the scrub cleaning the cleaning water is apt to stay at the wafer center part.