Title:
Scrubber
Document Type and Number:
Japanese Patent JP6334026
Kind Code:
B2
Abstract:
A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
Inventors:
Yu Ishii
River Saki Hiroyuki
Kenichi Nagaoka
Kenya Ito
Masako Kodera
Hiroshi Tomita
Nishioka
River Saki Hiroyuki
Kenichi Nagaoka
Kenya Ito
Masako Kodera
Hiroshi Tomita
Nishioka
Application Number:
JP2017051113A
Publication Date:
May 30, 2018
Filing Date:
March 16, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304; B08B1/04; B24B21/06
Domestic Patent References:
| JP2003007666A | ||||
| JP61203643A | ||||
| JP2000296368A | ||||
| JP2010278103A | ||||
| JP2010080477A | ||||
| JP2010087338A | ||||
| JP2000176386A | ||||
| JP10189511A |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe
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