Title:
SEAL STRUCTURE
Document Type and Number:
Japanese Patent JP2014200938
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce curing time of a resin material without deteriorating the adhesive force (separation load) between an adherend and a seal body.SOLUTION: An expandable resin material applied to a metal mold is cured by heating the metal mold, and a seal body 20 thus formed is adhered to a predetermined adherend 10 to be pressed by the metal mold during the heating, resulting in a seal structure. An embedding part 14 penetrated into the seal body 20 is disposed on an adhesive surface 12 of the adherend 10 with respect to the seal body 20.
Inventors:
SASAOKA KATSUHIRO
Application Number:
JP2013076638A
Publication Date:
October 27, 2014
Filing Date:
April 02, 2013
Export Citation:
Assignee:
KOJIMA PRESS KOGYO KK
International Classes:
B29C65/02; C09K3/10; F16B11/00; F16J15/14
Domestic Patent References:
| JP2002160577A | 2002-06-04 | |||
| JPH0493227A | 1992-03-26 | |||
| JPH0973812A | 1997-03-18 | |||
| JPH1130334A | 1999-02-02 | |||
| JP2005003181A | 2005-01-06 | |||
| JP2001280507A | 2001-10-10 |
Attorney, Agent or Firm:
Patent business corporation Okada international patent firm
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