Title:
SEALANT COMPOSITION FOR LIGHT-EMITTING DIODE
Document Type and Number:
Japanese Patent JP2015120767
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sealant composition for a light-emitting diode (LED), comprising a fluorescent material and a resin serving as a base for sealing, where the fluorescent material contained in the composition is in a good dispersion state and, when the light-emitting diode is sealed, variations in chromaticity of the light-emitting diode can be reduced.SOLUTION: There is provided a sealant composition for a light-emitting diode, comprising (I) a silsesquioxane derivative, (II) a fluorescent material, and (III) a resin, where an average particle diameter of the (I) silsesquioxane derivative is 0.1 to 50 nm.
Inventors:
TAKENAKA JUNJI
MOMOTA JUNJI
OHARA MASAKAZU
MOMOTA JUNJI
OHARA MASAKAZU
Application Number:
JP2012092778A
Publication Date:
July 02, 2015
Filing Date:
April 16, 2012
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
C08L101/00; C08L83/04; H01L23/29; H01L23/31; H01L33/50