Title:
SEALANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING IT
Document Type and Number:
Japanese Patent JP2012059868
Kind Code:
A
Abstract:
To provide a sealant for optical semiconductor device which is less susceptible to cracking or peeling even if it is used in harsh environments.
The sealant for optical semiconductor device includes: first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom (excepting organopolysiloxane having a hydrogen atom bonded to a silicon atom); second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylated reaction; and a compound having a structural unit represented by formula (A). In the formula (A), R represents a hydrogen atom or an 1-4C alkyl group.
Inventors:
TANIGAWA MITSURU
WATANABE TAKASHI
INUI YASUSHI
KUNIHIRO YOSHITAKA
YAMAZAKI RYOSUKE
KOBAYASHI YUSUKE
WATANABE TAKASHI
INUI YASUSHI
KUNIHIRO YOSHITAKA
YAMAZAKI RYOSUKE
KOBAYASHI YUSUKE
Application Number:
JP2010200758A
Publication Date:
March 22, 2012
Filing Date:
September 08, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01L33/56; C08K5/13; C08L83/05; C08L83/07; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005146191A | 2005-06-09 | |||
| JP2004292714A | 2004-10-21 | |||
| JP2005314591A | 2005-11-10 |
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama