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Title:
SEALED LETTER FOR DELIVERING NON-CONTACT IC CARD
Document Type and Number:
Japanese Patent JP2004352342
Kind Code:
A
Abstract:

To provide a sealed letter for delivering a non-contact IC card in a stable state, preventing data recorded in the non-contact IC card from being altered.

The sealed letter 21 for delivering non-contact IC card is prepared by piling an electromagnetic shield sheet 5 made of an electromagnetic shield material as an upper envelope paper 3 and a lower envelope paper 4 and closing three sides of piled the upper envelope paper 3 and the lower envelope paper 4 and remaining one side open, wherein the non-contact IC card 10, which can be cut off by a perforation 9, is partitioned and formed on the piled lower envelope paper 4, the electromagnetic shield sheet 5 and a sealing section 15 provided on the open side is coated with an adhesive 14 for sealing to be sealed.


Inventors:
UMEDA MAKOTO
Application Number:
JP2003155300A
Publication Date:
December 16, 2004
Filing Date:
May 30, 2003
Export Citation:
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Assignee:
TOPPAN FORMS CO LTD
International Classes:
B42D15/02; B42D15/10; B65D27/00; B65D27/02; G06K19/00; H05K9/00; (IPC1-7): B65D27/00; B42D15/02; B42D15/10; B65D27/02; G06K19/00; H05K9/00
Attorney, Agent or Firm:
Taichi Chiba