Title:
SEALED STRUCTURE OF THROUGH-HOLE
Document Type and Number:
Japanese Patent JP2014126078
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sealed structure of a through-hole, which can improve sealing performance by suppressing peeling off of a sealant provided between the through-hole and piping.SOLUTION: In a sealed structure of a through-hole, a sleeve 14 is fixed to a through-hole 12 that is formed in a vertical wall 11 of a building; piping 13 is inserted into the sleeve 14; and a space part 15 between the sleeve 14 and the piping 13 is sealed. An inner surface 14a of the sleeve 14 is provided with a first locking part 21 for being locked to a sealant 16, and an outer surface 13a of the piping 13 is provided with a second locking part 22 for being locked to the sealant 16.
Inventors:
WATANABE HISAKUNI
IWAMOTO YOICHI
FUKUYA YASUTAKA
MUROYA ITARU
IWATA TOMOKAZU
KONDO YUJI
IWAMOTO YOICHI
FUKUYA YASUTAKA
MUROYA ITARU
IWATA TOMOKAZU
KONDO YUJI
Application Number:
JP2012281617A
Publication Date:
July 07, 2014
Filing Date:
December 25, 2012
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
F16L5/02; F16J15/10
Attorney, Agent or Firm:
Hiroaki Sakai
Jun Takamura
Jun Takamura