Title:
SEALER FOR RELEASE SUBSTRATE, RELEASE SUBSTRATE AND METHOD FOR MANUFACTURING RELEASE SUBSTRATE
Document Type and Number:
Japanese Patent JP2008239984
Kind Code:
A
Abstract:
To provide a novel sealer for a release substrate capable of easily carrying out viscosity adjustment, not exerting a bad influence on curability and adhesiveness of a silicone release agent, and capable of manufacturing a release substrate having a small release load and a small change of the release load over time.
The sealer for the release substrate including 100 pts.wt. of an active energy ray curable resin (a) containing a vinyl group, and 1-60 pts.wt. of water, is used.
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Inventors:
OYAMA YOJI
SAWADA HIROSHI
SAWADA HIROSHI
Application Number:
JP2008048466A
Publication Date:
October 09, 2008
Filing Date:
February 28, 2008
Export Citation:
Assignee:
ARAKAWA CHEM IND
International Classes:
C09D4/00; B32B27/00; B32B27/16; B32B27/30; C09D5/00; C09K3/00
Domestic Patent References:
JPH10316940A | 1998-12-02 | |||
JP2000186247A | 2000-07-04 | |||
JPH07292320A | 1995-11-07 | |||
JPH06136015A | 1994-05-17 | |||
JP2002240203A | 2002-08-28 | |||
JPH0727837U | 1995-05-23 |
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