Title:
Sealing agent film
Document Type and Number:
Japanese Patent JP6115742
Kind Code:
B2
Abstract:
An encapsulant film and an optoelectronic device are provided. The encapsulant film having improved thermal resistance, and excellent adhesion, especially, long-term adhesive properties, to a front substrate and a back sheet can be provided. Also, the optoelectronic device capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated by the encapsulant film can be provided.
Inventors:
Sun Ho Choi
Jeong Hoon Lee
The Young Woo
Hyo Ju Kim
Jin Sam Gon
Jeong Hoon Lee
The Young Woo
Hyo Ju Kim
Jin Sam Gon
Application Number:
JP2015549275A
Publication Date:
April 19, 2017
Filing Date:
December 24, 2013
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08J5/18; H01L31/048; H05B33/04; H05B33/14
Domestic Patent References:
| JP2012214555A | ||||
| JP2009256459A | ||||
| JP2001131358A | ||||
| JP2007318008A | ||||
| JP2012092197A | ||||
| JP2011192694A |
Foreign References:
| US20120139132 | ||||
| WO2009154209A1 | ||||
| WO2010131716A1 | ||||
| WO2010140343A1 | ||||
| WO2005093005A1 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe
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